The third generation C3 automatic nozzle cleaning machine AC24P-5
With the development of SMT, the miniaturization and high-density placement of parts has become a trend. Subsequently, the suction nozzle of the SMT placement machine is more precise, which has a greater impact on the placement quality. In the actual placement process, due to the suction nozzle being contaminated with solder, flux or other dirt, the suction nozzle is clogged, which is easy to cause throwing. Earlier, we could not solve the problem with steel needle stabbing or ultrasonic vibration. The nozzle cleaning machine developed in response to this situation adopts a new cleaning method, which can remove the dirt on the nozzle that could not be removed in a short time. And the nozzle will not be damaged during the cleaning process. Because the non-toxic and harmless cleaning fluid is used, the whole process is more environmentally friendly.